- 专利标题: Cooling structure of heating element and power conversion device
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申请号: US15231244申请日: 2016-08-08
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公开(公告)号: US09807913B2公开(公告)日: 2017-10-31
- 发明人: Daisuke Matsumoto , Akira Mima , Tetsuya Kawashima , Yuuichi Mabuchi , Yukio Hattori , Hiroshi Kamizuma , Ryouhei Miyagawa , Tomonori Ichikawa
- 申请人: Hitachi, Ltd.
- 申请人地址: JP Tokyo
- 专利权人: Hitachi, Ltd.
- 当前专利权人: Hitachi, Ltd.
- 当前专利权人地址: JP Tokyo
- 代理机构: Crowell & Moring LLP
- 优先权: JP2014-198049 20140929
- 主分类号: G06F1/16
- IPC分类号: G06F1/16 ; H05K5/00 ; H05K7/00 ; H05K7/20 ; H01L35/32 ; H01L35/04 ; H01L23/40 ; H01L23/367 ; H01L23/427
摘要:
A cooling structure of a heating element includes: the heating element having at least one cooling surface from which a plurality of pin fins project; a heat receiving plate which has a shape complying with the cooling surface and in which holes are formed at positions facing each pin fin, each pin fin being movably inserted into the holes; a cooler which has a pair of clamping members that sandwich therebetween the heating element and the heat receiving plate while pressing the heating element and the heat receiving plate, and which cools the heat receiving plate; and a space securing part which is provided on the heat receiving plate and suppresses a distance between the pair of clamping members so as not to apply a pressing force by the clamping members to the heating element.
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