An electronic device and related method that includes a metal member, a circuit board, and a shielding member. A through hole or slot is disposed on the metal member. The shielding member is fastened on the metal member. The shielding member includes a blocking portion and an enclosing portion. The blocking portion is made of an electrically conductive plastic material. The enclosing portion is made of a metal material or an electrically conductive plastic material. The blocking portion is configured to block the through hole or slot. The enclosing portion is disposed around the electronic component. One end of the enclosing portion is electrically connected to the metal member, and the other end of the enclosing portion is electrically connected to the circuit board. The metal member, the blocking portion, the enclosing portion, and the circuit board form a shielding space, and the electronic component is located in the shielding space.