A plurality of at least two modular flooring tiles coupled together to form an upper surface defined by an outer perimeter is disclosed. A plurality of side walls extends downward from the outer perimeter and a plurality of coupling members are disposed about the side walls adapted to mate with coupling members of an adjacent flooring panel. A flexible continuous synthetic overlay is disposed about and secured to the upper surface of the at least two modular flooring tiles, wherein the synthetic overlay comprises an outer perimeter substantially similar to the outer perimeter of the at least two modular flooring tiles.