Invention Grant
- Patent Title: Chip module and method for forming the same
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Application No.: US14994537Application Date: 2016-01-13
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Publication No.: US09812413B2Publication Date: 2017-11-07
- Inventor: Ho-Yin Yiu , Ying-Nan Wen , Chien-Hung Liu
- Applicant: XINTEC INC.
- Applicant Address: TW Taoyuan
- Assignee: XINTEC INC.
- Current Assignee: XINTEC INC.
- Current Assignee Address: TW Taoyuan
- Agency: Liu & Liu
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/31 ; H01L29/06

Abstract:
A chip module is provided. The chip module includes a chip having an upper surface, a lower surface and a sidewall. The chip includes a signal pad region adjacent to the upper surface. A recess extends from the upper surface toward the lower surface along the sidewall of the chip. A redistribution layer is electrically connected to the signal pad region and extends into the recess. A circuit board is located between the upper surface and the lower surface and extends into the recess. A conducting structure is located in the recess and electrically connects the circuit board to the redistribution layer. A method for forming the chip module is also provided.
Public/Granted literature
- US20160211233A1 CHIP MODULE AND METHOD FOR FORMING THE SAME Public/Granted day:2016-07-21
Information query
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