- 专利标题: Semiconductor devices and methods for fabricating the same
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申请号: US14963271申请日: 2015-12-09
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公开(公告)号: US09812448B2公开(公告)日: 2017-11-07
- 发明人: Oh-Seong Kwon , Jin-Kyu Jang , Wan-Don Kim , Hoon-Joo Na , Sang-Jin Hyun
- 申请人: Oh-Seong Kwon , Jin-Kyu Jang , Wan-Don Kim , Hoon-Joo Na , Sang-Jin Hyun
- 申请人地址: KR
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR
- 代理机构: Myers Bigel, P.A.
- 优先权: KR10-2014-0182131 20141217; KR10-2015-0148870 20151026
- 主分类号: H01L27/088
- IPC分类号: H01L27/088 ; H01L21/28 ; H01L29/49 ; H01L29/66 ; H01L27/02 ; H01L27/11 ; H01L29/51 ; H01L29/78 ; H01L29/165 ; H01L21/8234
摘要:
Provided are a semiconductor device configured to block a physical diffusion path by forming an oxide layer between barrier layers to prevent impurities from being diffused through the physical diffusion path between the barrier layers, and a method for fabricating the semiconductor device. The semiconductor device includes a gate insulation layer formed on a substrate, a first barrier layer formed on the gate insulation layer, an oxide layer formed on the first barrier layer, the oxide layer including an oxide formed by oxidizing a material included in the first barrier layer, a second barrier layer formed on the oxide layer, a gate electrode formed on the second barrier layer, and source/drains disposed at opposite sides of the gate electrode in the substrate.
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