Invention Grant
- Patent Title: Thermoelectric conversion structure and its use in heat dissipation device
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Application No.: US13846211Application Date: 2013-03-18
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Publication No.: US09812629B2Publication Date: 2017-11-07
- Inventor: Hsiao-Hsuan Hsu , Chun-Hu Cheng , Ya-Wen Chou , Yu-Li Lin
- Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Applicant Address: TW Hsinchu
- Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee Address: TW Hsinchu
- Agency: Nixon Peabody LLP
- Priority: TW101125414A 20120713; TW101144037A 20121123
- Main IPC: H01L35/30
- IPC: H01L35/30 ; H01L35/08 ; B82Y30/00

Abstract:
The disclosure provides a thermoelectric conversion structure and its use in heat dissipation device. The thermoelectric conversion structure includes a thermoelectric element, a first electrode and an electrically conductive heat-blocking layer. The thermoelectric element includes a first end and a second end opposite to each other. The first electrode is located at the first end of the thermoelectric element. The electrically conductive heat-blocking layer is between the thermoelectric element and the first electrode.
Public/Granted literature
- US20140014152A1 THERMOELECTRIC CONVERSION STRUCTURE AND ITS USE IN HEAT DISSIPATION DEVICE Public/Granted day:2014-01-16
Information query
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