Invention Grant
- Patent Title: Fluid ejection structure
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Application No.: US15120676Application Date: 2014-06-30
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Publication No.: US09815282B2Publication Date: 2017-11-14
- Inventor: Bradley D. Chung , Galen P. Cook , Michael H. Hayes , Adam L. Ghozeil , Chantelle Elizabeth Domingue , Valerie J. Marty , Anthony M. Fuller , Sterling Chaffins
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agency: HP Inc. Patent Department
- International Application: PCT/US2014/044845 WO 20140630
- International Announcement: WO2016/003407 WO 20160107
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/16 ; B41J29/377
Abstract:
A fluid ejection structure can include thermal resistors, a substrate, layers on the substrate, wherein said layers can include a region proximate to the resistor that has reduced field oxide.
Public/Granted literature
- US20170106651A1 FLUID EJECTION STRUCTURE Public/Granted day:2017-04-20
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