- 专利标题： Interconnect reliability structures
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申请号： US15048704申请日： 2016-02-19
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公开(公告)号： US09817063B2公开(公告)日： 2017-11-14
- 发明人: Ping-Chuan Wang , Andrew T. Kim , Ronald G. Filippi
- 申请人： GLOBALFOUNDRIES INC.
- 申请人地址： KY Grand Cayman
- 专利权人： GLOBALFOUNDRIES INC.
- 当前专利权人： GLOBALFOUNDRIES INC.
- 当前专利权人地址： KY Grand Cayman
- 代理机构： Roberts Mlotkowski Safran Cole & Calderon, P.C.
- 代理商 Michael Le Strange; Andrew M. Calderon
- 主分类号： G01R31/28
- IPC分类号： G01R31/28 ; H01L21/66 ; H01L23/522 ; H01L27/08
摘要：
The present disclosure relates to semiconductor structures and, more particularly, to interconnect reliability structures and methods of manufacture. The structure includes: a plurality of resistors; and a voltmeter configured to sense a relative difference in resistance of the plurality of resistors indicative of at least one of a via-depletion and line-depletion.
公开/授权文献
- US20170242067A1 INTERCONNECT RELIABILITY STRUCTURES 公开/授权日：2017-08-24
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