Invention Grant
- Patent Title: Substrate support and semiconductor manufacturing apparatus
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Application No.: US13785134Application Date: 2013-03-05
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Publication No.: US09824911B2Publication Date: 2017-11-21
- Inventor: Akihito Ohno , Zempei Kawazu
- Applicant: Akihito Ohno , Zempei Kawazu
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Leydig, Voit & Mayer
- Priority: JP2012-129717 20120607
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/687

Abstract:
A substrate support for supporting a substrate when forming a film on a surface of the substrate by chemical vapor deposition. The substrate support includes a graphite material having a recessed portion for accommodating the substrate, a multilayer film on the recessed portion and consisting of a first degassing prevention film of SiC and a sublimation prevention film of TaC or HfC stacked together, and a second degassing prevention film of SiC located on portions of the graphite material other than the recessed portion.
Public/Granted literature
- US20130327274A1 SUBSTRATE SUPPORT AND SEMICONDUCTOR MANUFACTURING APPARATUS Public/Granted day:2013-12-12
Information query
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