- 专利标题: Semiconductor device comprising a transistor array and a termination region and method of manufacturing such a semiconductor device
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申请号: US15040624申请日: 2016-02-10
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公开(公告)号: US09825170B2公开(公告)日: 2017-11-21
- 发明人: Franz Hirler , Andreas Meiser , Till Schloesser
- 申请人: Franz Hirler , Andreas Meiser , Till Schloesser
- 申请人地址: DE Neubiberg
- 专利权人: Infineon Technologies AG
- 当前专利权人: Infineon Technologies AG
- 当前专利权人地址: DE Neubiberg
- 代理机构: Baker Botts L.L.P.
- 优先权: DE102015102115 20150213
- 主分类号: H01L21/00
- IPC分类号: H01L21/00 ; H01L29/78 ; H01L21/765 ; H01L21/8234 ; H01L27/088 ; H01L29/06 ; H01L29/66 ; H01L29/10 ; H01L29/40 ; H01L29/423 ; H01L21/265 ; H01L29/417
摘要:
A semiconductor device formed in a semiconductor substrate having a first main surface comprises a transistor array and a termination region. The transistor array comprises a source region, a drain region, a body region, a drift zone, and a gate electrode at the body region. The gate electrode is configured to control a conductivity of a channel formed in the body region. The gate electrode is disposed in first trenches. The body region and the drift zone are disposed along a first direction between the source region and the drain region, the first direction being parallel to the first main surface. The body region has a shape of a first ridge extending along the first direction. The termination region comprises a termination trench, a portion of the termination trench extending in the first direction, a length of the termination trench being larger than a length of the first trenches, the length being measured along the first direction.
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