An electrical power circuit assembly includes a heat sink having a first surface portion and a second surface portion, a power semiconductor module being in thermal contact with the first surface portion of the heat sink for dissipating heat from the power semiconductor module to the heat sink via the first heat sink surface portion, and a capacitor having an axis. The capacitor is arranged with its axis essentially parallel to the second heat sink surface portion and with a circumferential surface portion being in thermal contact with the second surface portion of the heat sink for dissipating heat from the capacitor to the heat sink via the second heat sink surface portion.