Invention Grant
- Patent Title: System and method for estimating performance, power, area and cost (PPAC)
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Application No.: US15201328Application Date: 2016-07-01
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Publication No.: US09830413B2Publication Date: 2017-11-28
- Inventor: Sandeep Kumar Goel , Tze-Chiang Huang , Yun-Han Lee
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Maschoff Brennan
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
A method is disclosed that includes establishing an intellectual property (IP) bank, an application bank, and a technology bank; selecting valid configurations from the IP bank for corresponding IPs and at least one subsystem based on the application data, for generating in response to a user-defined requirement, by a model generator, a performance, power, area and cost (PPAC) model of the valid configurations; based on the PPAC model, creating at least one architecture comprising at least one of the corresponding IPs, and at least one of the valid configurations for the at least one of the corresponding IPs; and, estimating, by a PPAC explorer assessing the technology bank, at least one of a performance value, a power value, an area value and a cost value for a fabrication of the at least one architecture by simulating available fabrication process technology based on the technology bank.
Public/Granted literature
- US20170076028A1 SYSTEM AND METHOD FOR ESTIMATING PERFORMANCE, POWER, AREA AND COST (PPAC) Public/Granted day:2017-03-16
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