Invention Grant
- Patent Title: Headphone driver for attenuating pop and click noises and system on chip having the same
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Application No.: US14542936Application Date: 2014-11-17
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Publication No.: US09832563B2Publication Date: 2017-11-28
- Inventor: Myung-Jin Lee , Pan-Jong Kim
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2014-0017350 20140214
- Main IPC: H04R1/10
- IPC: H04R1/10 ; H03G3/34 ; H04R3/00

Abstract:
A headphone driver includes a pre-main amplifier and a main amplifier. The pre-main amplifier receives an input signal from first and second node and outputs the input signal to a third node. The main amplifier is between the third node and a fourth node. A first switch is between the fourth node and a fifth node. A second switch is between the fourth node and a sixth node. A third switch is between the fourth node and a seventh node. A fourth switch is between the fifth and seventh nodes. A fifth switch is between the first and fifth nodes. A capacitor is between the third and fifth nodes. A first feedback resistor is between the first and seventh nodes. A second feedback resistor is between the second and sixth nodes, and the sixth and seventh nodes are connected to a speaker.
Public/Granted literature
- US20150237438A1 HEADPHONE DRIVER FOR ATTENUATING POP AND CLICK NOISES AND SYSTEM ON CHIP HAVING THE SAME Public/Granted day:2015-08-20
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