Invention Grant
- Patent Title: Semiconductor packages including upper and lower packages and heat dissipation parts
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Application No.: US14885566Application Date: 2015-10-16
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Publication No.: US09842799B2Publication Date: 2017-12-12
- Inventor: Eon Soo Jang
- Applicant: Samsung Electronics Co., Ltd
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Ward and Smith, P.A.
- Priority: KR10-2014-0146284 20141027
- Main IPC: H01L23/367
- IPC: H01L23/367 ; H01L23/498 ; H01L25/10 ; H01L25/065
Abstract:
A semiconductor package includes a lower package with a lower substrate and a lower semiconductor chip. A heat dissipation part is provided adjacent to a side of the lower package and covers a portion of the lower semiconductor chip, and an upper package is on the lower package and is laterally spaced apart from the heat dissipation part.
Public/Granted literature
- US20160118366A1 Semiconductor Packages Including Heat Dissipation Parts Public/Granted day:2016-04-28
Information query
IPC分类:
