Invention Grant
- Patent Title: Substrate and method for labeling signal lines thereof
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Application No.: US14288351Application Date: 2014-05-27
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Publication No.: US09852996B2Publication Date: 2017-12-26
- Inventor: Wei Xu , Zhaokeng Cao , Yan Jia , Xiangmin Tan , Di Zhu , Yinghua Mo , Wenze Shan
- Applicant: Shanghai Tianma Micro-Electronics Co., Ltd , Tianma Micro-Electronics Co., Ltd.
- Applicant Address: CN Shanghai CN Shenzhen
- Assignee: SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.,TIANMA MICRO-ELECTRONICS CO., LTD.
- Current Assignee: SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.,TIANMA MICRO-ELECTRONICS CO., LTD.
- Current Assignee Address: CN Shanghai CN Shenzhen
- Agency: Alston & Bird LLP
- Priority: CN201310724480 20131224
- Main IPC: H01L27/14
- IPC: H01L27/14 ; H01L29/04 ; H01L29/15 ; H01L31/036 ; H01L23/544 ; H01L27/12

Abstract:
A substrate is disclosed. The substrate includes a transparent underlayer, a plurality of signal lines on the transparent underlayer, and a plurality of labels on the transparent underlayer. The plurality of labels respectively correspond to the plurality of signal lines in a one-to-one relationship and are configured to identify the corresponding signal lines, and one of at least two adjacent labels is a forward pattern label, and another one of the at least two adjacent labels is a reverse pattern label.
Public/Granted literature
- US20150179585A1 SUBSTRATE AND METHOD FOR LABELING SIGNAL LINES THEREOF Public/Granted day:2015-06-25
Information query
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