Invention Grant
- Patent Title: Substrate and terminals for power module and power module including the same
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Application No.: US14079007Application Date: 2013-11-13
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Publication No.: US09853378B2Publication Date: 2017-12-26
- Inventor: Che-Heung Kim , Chang-Sik Kim , Seong-woon Booh
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2013-0014124 20130207
- Main IPC: H01R12/57
- IPC: H01R12/57 ; H05K7/14 ; H01R12/70 ; H01L25/07 ; H02M7/00

Abstract:
According to example embodiments, a substrate for a power module includes first to third parts spaced apart from each other, where the third part surrounds the first and second parts, and a conductive layer on the first to third parts. A terminal of a first polarity is connected to the first part, and a terminal of a second polarity is connected to the second part. The first and second terminals may be spaced apart from each other and each have a coupling part, a body, and a contact part. The bodies of the first and second terminals may overlap each other. A power module may include the substrate.
Public/Granted literature
- US20140218871A1 SUBSTRATE AND TERMINALS FOR POWER MODULE AND POWER MODULE INCLUDING THE SAME Public/Granted day:2014-08-07
Information query
IPC分类: