Invention Grant
- Patent Title: Pattern inspecting and measuring device and program
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Application No.: US14433698Application Date: 2013-10-11
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Publication No.: US09858659B2Publication Date: 2018-01-02
- Inventor: Tsuyoshi Minakawa , Takashi Hiroi , Takeyuki Yoshida , Taku Ninomiya , Takuma Yamamoto , Hiroyuki Shindo , Fumihiko Fukunaga , Yasutaka Toyoda , Shinichi Shinoda
- Applicant: Hitachi High-Technologies Corporation
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Technologies Corporation
- Current Assignee: Hitachi High-Technologies Corporation
- Current Assignee Address: JP Tokyo
- Agency: Crowell & Moring LLP
- Priority: JP2012-227590 20121015
- International Application: PCT/JP2013/077721 WO 20131011
- International Announcement: WO2014/061575 WO 20140424
- Main IPC: G06T7/00
- IPC: G06T7/00 ; H01J37/244 ; G06K9/46 ; G06K9/52 ; G06T7/13

Abstract:
Provided is a pattern inspecting and measuring device that decreases the influence of noise and the like and increases the reliability of an inspection or measurement result during inspection or measurement using the position of an edge extracted from image data obtained by imaging a pattern as the object of inspection or measurement. For this purpose, in the pattern inspecting and measuring device in which inspection or measurement of an inspection or measurement object pattern is performed using the position of the edge extracted, with the use of an edge extraction parameter, from the image data obtained by imaging the inspection or measurement object pattern, the edge extraction parameter is generated using a reference pattern having a shape as an inspection or measurement reference and the image data.
Public/Granted literature
- US20150228063A1 Pattern Inspecting and Measuring Device and Program Public/Granted day:2015-08-13
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