Invention Grant
- Patent Title: Encapsulated micro-electromechanical system switch and method of manufacturing the same
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Application No.: US14874704Application Date: 2015-10-05
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Publication No.: US09859076B2Publication Date: 2018-01-02
- Inventor: Jonathan Hale Hammond , Julio C. Costa
- Applicant: RF Micro Devices, Inc.
- Applicant Address: US NC Greensboro
- Assignee: Qorvo US, Inc.
- Current Assignee: Qorvo US, Inc.
- Current Assignee Address: US NC Greensboro
- Agency: Withrow & Terranova, P.L.L.C.
- Main IPC: H01H49/00
- IPC: H01H49/00 ; H01H1/00 ; H01H59/00 ; B81C1/00
Abstract:
Encapsulated MEMS switches are disclosed along with methods of manufacturing the same. A first sacrificial layer is used to form the actuation member of the MEMS switch. A second sacrificial layer is used to form the enclosure that encapsulates the MEMS switch.
Public/Granted literature
- US20160027601A1 ENCAPSULATED MICRO-ELECTROMECHANICAL SYSTEM SWITCH AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2016-01-28
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