Invention Grant
- Patent Title: Image sensor bending by induced substrate swelling
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Application No.: US15398266Application Date: 2017-01-04
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Publication No.: US09859314B2Publication Date: 2018-01-02
- Inventor: Geoffrey P. McKnight , John J. Vajo , Jason A. Graetz
- Applicant: Microsoft Technology Licensing, LLC
- Applicant Address: US WA Redmond
- Assignee: Microsoft Technology Licensing, LLC
- Current Assignee: Microsoft Technology Licensing, LLC
- Current Assignee Address: US WA Redmond
- Agency: Drinker Biddle & Reath LLP
- Main IPC: H01L31/0232
- IPC: H01L31/0232 ; H01L21/02 ; H01L31/00 ; H01L27/146
Abstract:
A curved image sensor chip has a first side and a second side opposite the first side. The second side includes light sensors configured to generate electrical signals in response to receiving light. A substrate is in contact with the first side of the curved image sensor chip and is configured to increase in volume so as to apply a bending force to form the curved image sensor chip.
Public/Granted literature
- US20170117311A1 IMAGE SENSOR BENDING BY INDUCED SUBSTRATE SWELLING Public/Granted day:2017-04-27
Information query
IPC分类:
