- 专利标题: IGBT having deep gate trench
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申请号: US15078168申请日: 2016-03-23
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公开(公告)号: US09859407B2公开(公告)日: 2018-01-02
- 发明人: Yi Tang , Niraj Ranjan , Chiu Ng
- 申请人: Infineon Technologies Americas Corp.
- 申请人地址: US CA El Segundo
- 专利权人: Infineon Technologies Americas Corp.
- 当前专利权人: Infineon Technologies Americas Corp.
- 当前专利权人地址: US CA El Segundo
- 代理机构: Murphy, Bilak & Homiller, PLLC
- 主分类号: H01L29/10
- IPC分类号: H01L29/10 ; H01L29/739 ; H01L29/06 ; H01L29/08 ; H01L29/417 ; H01L29/45
摘要:
There are disclosed herein various implementations of an insulated-gate bipolar transistor (IGBT) with buried depletion electrode. Such an IGBT may include a collector at a bottom surface of a semiconductor substrate, a drift region having a first conductivity type situated over the collector, and a base layer having a second conductivity type opposite the first conductivity type situated over the drift region. The IGBT also includes a plurality of deep insulated trenches with a buried depletion electrode and at least one gate electrode disposed therein. In addition, the IGBT includes an active cell including an emitter adjacent the gate electrode, and an implant zone, situated between adjacent deep insulated trenches. The implant zone is formed below the base layer and has the first conductivity type. In one implementation, the IGBT may also include a dummy cell neighboring the active cell.
公开/授权文献
- US20160204238A1 IGBT Having Deep Gate Trench 公开/授权日:2016-07-14
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