- 专利标题: Semiconductor integrated circuit
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申请号: US14971461申请日: 2015-12-16
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公开(公告)号: US09865601B2公开(公告)日: 2018-01-09
- 发明人: Kai-Chun Lin , Yu-Der Chih , Chia-Fu Lee
- 申请人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- 申请人地址: TW Hsinchu
- 专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- 当前专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- 当前专利权人地址: TW Hsinchu
- 代理机构: WPAT, P.C., Intellectual Property Attorneys
- 代理商 Anthony King
- 主分类号: H01L27/11
- IPC分类号: H01L27/11 ; H01L27/105 ; H01L27/02
摘要:
The present disclosure relates to a semiconductor integrated circuit. The semiconductor integrated circuit includes a substrate, a first transistor and a first patterned conductive layer. The first transistor has a source region, a drain region in the substrate and a gate region on the substrate. The first patterned conductive layer is electrically connected to the drain region of the first transistor. The first patterned conductive layer includes a first section, a second section and a fusible device.
公开/授权文献
- US20170179131A1 SEMICONDUCTOR INTEGRATED CIRCUIT 公开/授权日:2017-06-22
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