发明授权
- 专利标题： Solid-state imaging device, manufacturing method therefor, and imaging apparatus
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申请号： US15007704申请日： 2016-01-27
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公开(公告)号： US09865641B2公开(公告)日： 2018-01-09
- 发明人: Yoshiaki Takemoto
- 申请人： OLYMPUS CORPORATION
- 申请人地址： JP Tokyo
- 专利权人： OLYMPUS CORPORATION
- 当前专利权人： OLYMPUS CORPORATION
- 当前专利权人地址： JP Tokyo
- 代理机构： Westerman, Hattori, Daniels & Adrian, LLP
- 优先权： JP2013-168177 20130813
- 主分类号： H01L31/0203
- IPC分类号： H01L31/0203 ; H01L27/146
摘要：
A solid-state imaging device includes: a first chip including a pixel array in which a plurality of photoelectric conversion portions converting incident light into an electric signal are disposed; a second chip having an area in a plan view less than an area of the first chip in the plan view and electrically and physically connected to the first chip; and a support portion provided to cover an entire region which is not covered with the second chip in a surface of the first chip connected to the second chip and configured to support the first chip so that flatness of the first chip may be maintained.
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