Invention Grant
- Patent Title: High frequency circuit module in which high frequency circuits are embedded in a multilayer circuit substrate
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Application No.: US14063754Application Date: 2013-10-25
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Publication No.: US09866265B2Publication Date: 2018-01-09
- Inventor: Tetsuo Saji , Hiroshi Nakamura
- Applicant: TAIYO YUDEN CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Chen Yoshimura LLP
- Priority: JP2013-082835 20130411
- Main IPC: H04B1/44
- IPC: H04B1/44 ; H04B1/48 ; H04B1/04 ; H04B1/18 ; H01L23/00 ; H01L23/538
Abstract:
A high frequency circuit module is provided with: a multilayer circuit substrate; a first high frequency switch that switches connection of an antenna; a transmission filter; and reception filters. Either the transmission filter or the reception filters, or both, and the first high frequency switch are embedded in the multilayer circuit substrate, and ground conductors are formed in a conductive layer facing embedded electronic components.
Public/Granted literature
- US20140308906A1 HIGH FREQUENCY CIRCUIT MODULE Public/Granted day:2014-10-16
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