Invention Grant
- Patent Title: Composition for metal plating comprising suppressing agent for void free submicron feature filling
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Application No.: US13387776Application Date: 2010-07-16
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Publication No.: US09869029B2Publication Date: 2018-01-16
- Inventor: Cornelia Roeger-Goepfert , Roman Benedikt Raether , Alexandra Haag , Dieter Mayer , Charlotte Emnet
- Applicant: Cornelia Roeger-Goepfert , Roman Benedikt Raether , Alexandra Haag , Dieter Mayer , Charlotte Emnet
- Applicant Address: DE Ludwigshafen
- Assignee: BASF SE
- Current Assignee: BASF SE
- Current Assignee Address: DE Ludwigshafen
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- International Application: PCT/EP2010/060276 WO 20100716
- International Announcement: WO2011/012462 WO 20110203
- Main IPC: C25D5/02
- IPC: C25D5/02 ; C25D3/58 ; C25D3/38 ; H01L21/288 ; H01L21/768 ; H05K3/42 ; C25D7/12

Abstract:
According to the present invention a composition is provided comprising at least one source of metal ions and at least one additive obtainable by reacting a) a polyhydric alcohol condensate compound derived from at least one polyalcohol of formula (I) X(OH)n (I) by condensation with b) at least one alkylene oxide to form a polyhydric alcohol condensate comprising polyoxyalkylene side chains, wherein n is an integer from 3 to 6 and X is an n-valent linear or branched aliphatic or cycloaliphatic radical having from 2 to 10 carbon atoms, which may be substituted or unsubstituted.
Public/Granted literature
- US20120128888A1 COMPOSITION FOR METAL PLATING COMPRISING SUPPRESSING AGENT FOR VOID FREE SUBMICRON FEATURE FILLING Public/Granted day:2012-05-24
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