Composition for metal plating comprising suppressing agent for void free submicron feature filling
Abstract:
According to the present invention a composition is provided comprising at least one source of metal ions and at least one additive obtainable by reacting a) a polyhydric alcohol condensate compound derived from at least one polyalcohol of formula (I) X(OH)n  (I) by condensation with b) at least one alkylene oxide to form a polyhydric alcohol condensate comprising polyoxyalkylene side chains, wherein n is an integer from 3 to 6 and X is an n-valent linear or branched aliphatic or cycloaliphatic radical having from 2 to 10 carbon atoms, which may be substituted or unsubstituted.
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