A method for processing a ceramic scintillator array, characterized in that, comprising the following steps: (a) forming, in a first direction, a predetermined number of straight first-direction through-cuts which are parallel to each other and spaced from each other on a scintillator substrate by using laser; (b) adequately filling the first-direction through-cuts with an adhesive and solidifying the adhesive; (c) forming, in a second direction. a predetermined number of second direction through-cuts which are parallel to each other at a predetermined interval on the scintillator substrate by using laser, wherein the second direction is perpendicular to the first direction; and (d) adequately filling the second direction through-cuts with the adhesive and solidifying the adhesive bond.