Invention Grant
- Patent Title: Integrated circuit and cable assembly including the same
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Application No.: US15078116Application Date: 2016-03-23
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Publication No.: US09871524B2Publication Date: 2018-01-16
- Inventor: Je Kook Kim , Jin Hyuck Yu , You So Cheon
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2015-0054721 20150417; KR10-2015-0169878 20151201
- Main IPC: H03K19/0185
- IPC: H03K19/0185 ; H03K19/003

Abstract:
An integrated circuit embedded in a plug of a universal serial bus (USB) 3.1 type-C cable assembly is disclosed. The integrated circuit includes a first pin connected to an operation transmission line through which an operation voltage is transmitted, a second pin connected to a configuration channel (CC) line, a first resistor connected to the first pin, a ground line, and a switching circuit configured to connect the first resistor and the ground line using a channel voltage supplied to the second pin when the operation voltage is not applied, and disconnect the first resistor from the ground line based on the operation voltage.
Public/Granted literature
- US20160308527A1 INTEGRATED CIRCUIT AND CABLE ASSEMBLY INCLUDING THE SAME Public/Granted day:2016-10-20
Information query
IPC分类: