Invention Grant
- Patent Title: Methods to support inter-eNodeB CoMP
-
Application No.: US14148467Application Date: 2014-01-06
-
Publication No.: US09871627B2Publication Date: 2018-01-16
- Inventor: Boon Loong Ng , Young-Han Nam , Thomas David Novlan
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Main IPC: H04L5/00
- IPC: H04L5/00

Abstract:
A method of executing inter-eNB CoMP JT between a CoMP UE and multiple CoMP eNBs is disclosed. A first CoMP eNB constructs a first set of dynamic control information (DCI). The first set of DCI is independently constructed by the first CoMP eNB. The first CoMP eNB transmits the first set of DCI to the CoMP UE. The first set of DCI includes independent DL assignments allowing the first CoMP eNB to perform independent scheduling of a PDSCH associated with the first CoMP eNB. A second CoMP eNB constructs a second set of DCI. The second set of DCI is independently constructed by the second CoMP eNB. Furthermore, the second CoMP eNB transmits the second set of DCI to the CoMP UE. The second set of DCI includes independent DL assignments allowing the second CoMP eNB to perform independent scheduling of a PDSCH associated with the second CoMP eNB.
Public/Granted literature
- US09923684B2 Methods to support inter-eNodeB CoMP Public/Granted day:2018-03-20
Information query