- Patent Title: Integrated circuit including NCEM-Enabled, tip-to-tip gap-configured fill cells, with NCEM pads formed from at least three conductive stripes positioned between adjacent gates
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Application No.: US15719577Application Date: 2017-09-29
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Publication No.: US09881843B1Publication Date: 2018-01-30
- Inventor: Stephen Lam , Dennis Ciplickas , Tomasz Brozek , Jeremy Cheng , Simone Comensoli , Indranil De , Kelvin Doong , Hans Eisenmann , Timothy Fiscus , Jonathan Haigh , Christopher Hess , John Kibarian , Sherry Lee , Marci Liao , Sheng-Che Lin , Hideki Matsuhashi , Kimon Michaels , Conor O'Sullivan , Markus Rauscher , Vyacheslav Rovner , Andrzej Strojwas , Marcin Strojwas , Carl Taylor , Rakesh Vallishayee , Larg Weiland , Nobuharu Yokoyama
- Applicant: PDF Solutions, Inc.
- Applicant Address: US CA San Jose
- Assignee: PDF Solutions, Inc.
- Current Assignee: PDF Solutions, Inc.
- Current Assignee Address: US CA San Jose
- Agent David Garrod
- Main IPC: H01L29/00
- IPC: H01L29/00 ; H01L21/66 ; H01L27/118 ; H01L29/417 ; H01L27/02 ; H01L23/528 ; G06F11/07 ; G06F17/50 ; H01L29/06
Abstract:
An integrated circuit, in the form of a wafer, die, or chip, includes multiple standard cell-compatible fill cells, configured to enable non-contact electrical measurements. Such fill cells include mesh pads that contain at least three conductive stripes disposed between adjacent gate stripes. Such fill cells further include geometry to enable non-contact evaluation of tip-to-tip shorts and/or leakages.
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