Invention Grant
- Patent Title: Low temperature poly-silicon thin film transistor and manufacturing method thereof, array substrate and display device
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Application No.: US14435538Application Date: 2014-08-07
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Publication No.: US09882057B2Publication Date: 2018-01-30
- Inventor: Hui Tian
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE Technology Group Co., Ltd.
- Current Assignee: BOE Technology Group Co., Ltd.
- Current Assignee Address: CN Beijing
- Agency: Collard & Roe, P.C.
- Priority: CN201410182783 20140430
- International Application: PCT/CN2014/083917 WO 20140807
- International Announcement: WO2015/165164 WO 20151105
- Main IPC: H01L27/14
- IPC: H01L27/14 ; H01L29/786 ; H01L21/02 ; H01L21/265 ; H01L21/266 ; H01L21/28 ; H01L21/30 ; H01L27/12 ; H01L29/66

Abstract:
A low temperature poly-silicon thin film transistor and its manufacturing method, an array substrate and a display device are provided. The method comprises: forming a poly-silicon film on a base substrate (1) and patterning the poly-silicon film to form an active layer (3); forming a gate insulation layer (4) on the active layer (3) and performing hydrogenation process to the gate insulation layer (4) and the active layer (3). By this method, the diffusion distance of hydrogen is largely shortened, the time for the hydrogenation process is reduced, and thus the process cost for the thin film transistor is largely lowered down.
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