Invention Grant
- Patent Title: Optoelectronic semiconductor chip, optoelectronic semiconductor component, and a method for producing an optoelectronic semiconductor component
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Application No.: US15227287Application Date: 2016-08-03
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Publication No.: US09882097B2Publication Date: 2018-01-30
- Inventor: Dominik Eisert , Torsten Baade , Michael Zitzlsperger
- Applicant: OSRAM Opto Semiconductors GmbH
- Applicant Address: DE
- Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee Address: DE
- Agency: DLA Piper LLP (US)
- Priority: DE102011050450 20110518
- Main IPC: H01L33/50
- IPC: H01L33/50 ; H01L33/44 ; H01L33/56 ; H01L33/60 ; H01L33/62 ; H01L33/52 ; H01L33/06 ; H01L33/28 ; H01L33/32 ; H01L33/48

Abstract:
An optoelectronic semiconductor chip includes a semiconductor body that emits primary light, and a luminescence conversion element that emits secondary light by wavelength conversion of at least part of the primary light, wherein the luminescence conversion element has a first lamina fixed to a first partial region of an outer surface of the semiconductor body, the outer surface emitting primary light, and leaving free a second partial region of the outer surface, the luminescence conversion element has a second lamina fixed to a surface of the first lamina facing away from the semiconductor body and spaced apart from the semiconductor body, the first lamina is at least partly transmissive to the primary radiation, a section of the second lamina covers at least the second partial region, and at least the section of the second lamina is absorbent and/or reflective and/or scattering for the primary radiation.
Public/Granted literature
Information query
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