Metal compounds, methods, and uses thereof

Invention Grant

US09882150B2 Metal compounds, methods, and uses thereof 有权

Patent Title: Metal compounds, methods, and uses thereof
Application No.: US14430454

Application Date: 2013-09-24
Publication No.: US09882150B2

Publication Date: 2018-01-30
Inventor: Jian Li , Guijie Li
Applicant: ARIZONA BOARD OF REGENTS FOR AND ON BEHALF OF ARIZONA STATE UNIVERSITY
Applicant Address: US AZ Scottsdale
Assignee: Arizona Board of Regents for and on behalf of Arizona State University
Current Assignee: Arizona Board of Regents for and on behalf of Arizona State University
Current Assignee Address: US AZ Scottsdale
Agency: Fish & Richardson P.C.
International Application: PCT/US2013/061353 WO 20130924
International Announcement: WO2014/047616 WO 20140327
Main IPC: H01L51/00
IPC: H01L51/00 ; C09K11/06 ; C07F15/00 ; H01L51/42 ; H01L51/50

Abstract:

Disclosed herein are metal compounds useful in devices, such as, for example, OLEDs.

Public/Granted literature

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L51/00	使用有机材料作有源部分或使用有机材料与其他材料的组合作有源部分的固态器件；专门适用于制造或处理这些器件或其部件的工艺方法或设备（由在一个公共衬底中或其上形成的多个组件组成的器件入H01L27/28;使用有机材料的热电器件入H01L35/00,H01L37/00；使用有机材料的压电、电致伸缩或磁致伸缩元件入H01L41/00）