Invention Grant
- Patent Title: Substrate-bonding device and method of the same
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Application No.: US15094202Application Date: 2016-04-08
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Publication No.: US09884452B2Publication Date: 2018-02-06
- Inventor: Ching-Chih Chen , Lin-Huei Wang , Lai-Peng Lai , Ying-Cheng Chen
- Applicant: Quanta Computer Inc.
- Applicant Address: TW Taoyuan
- Assignee: Quanta Computer Inc.
- Current Assignee: Quanta Computer Inc.
- Current Assignee Address: TW Taoyuan
- Agency: Rabin & Berdo, P.C.
- Priority: CN201610054468 20160127
- Main IPC: B32B41/00
- IPC: B32B41/00 ; B29C65/56 ; B29C63/00 ; B29C63/02 ; B29K709/08 ; B29L31/34

Abstract:
A method of bonding substrates includes steps as follows. Providing a curved glass substrate and a flexible light-transmissive film; moving a roller to press the flexible light-transmissive film onto the curved glass substrate so that the flexible light-transmissive film matches a curvature of the curved glass substrate to gradually fit and bond onto the curved glass substrate; sensing the attaching level of at least one local area of the flexible light-transmissive film bonded on the curved glass substrate; and adjusting a press force exerted by the roller to the local area of the flexible light-transmissive film according to the attaching level during the flexible light-transmissive film is bonded onto the curved glass substrate.
Public/Granted literature
- US20170210062A1 SUBSTRATE-BONDING DEVICE AND METHOD OF THE SAME Public/Granted day:2017-07-27
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