Invention Grant
- Patent Title: Epoxy-based resin composition for composite materials
-
Application No.: US14968952Application Date: 2015-12-15
-
Publication No.: US09884959B2Publication Date: 2018-02-06
- Inventor: Mark Richard Bonneau , Claude Billaud
- Applicant: Cytec Industries Inc.
- Applicant Address: US NJ Woodland Park
- Assignee: Cytec Industries Inc.
- Current Assignee: Cytec Industries Inc.
- Current Assignee Address: US NJ Woodland Park
- Agent Thi Dang
- Main IPC: B32B27/38
- IPC: B32B27/38 ; B32B27/26 ; B32B27/18 ; B32B27/04 ; C08J5/24 ; C08L63/00 ; C08G59/38 ; C08G59/24 ; C08G59/50 ; C08G59/22 ; C08G59/32

Abstract:
A curable, epoxy-based resin composition that can be combined with reinforcement fibers and then cured to form a cured product that is excellent in toughness and exhibits high Open-Hole Tensile (OHT) strength. According to one embodiment, the resin composition contains a Bisphenol F difunctional epoxy, an anthracyl compound, a tri-functional epoxy, a thermoplastic polymer, and an amine-containing curing agent.
Public/Granted literature
- US20160168372A1 EPOXY-BASED RESIN COMPOSITION FOR COMPOSITE MATERIALS Public/Granted day:2016-06-16
Information query