Invention Grant
- Patent Title: Thermally-aware process scheduling
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Application No.: US14180023Application Date: 2014-02-13
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Publication No.: US09886326B2Publication Date: 2018-02-06
- Inventor: Indrani Paul , Manish Arora , William Lloyd Bircher
- Applicant: Advanced Micro Devices, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Advanced Micro Devices, Inc.
- Current Assignee: Advanced Micro Devices, Inc.
- Current Assignee Address: US CA Santa Clara
- Main IPC: G06F1/32
- IPC: G06F1/32 ; G06F9/50 ; G06F1/20
Abstract:
A scheduler is presented that can adjust, responsive to a thermal condition at the processing device, a scheduling of process threads for compute units of the processing device so as to increase resource contentions between the process threads.
Public/Granted literature
- US20150227391A1 THERMALLY-AWARE PROCESS SCHEDULING Public/Granted day:2015-08-13
Information query
