According to embodiments, an electronic device includes: a housing including a face facing a first direction; a circuit board including first and second board faces substantially parallel to the face, and a side board face facing a second direction, the circuit board disposed within the housing; a first component disposed in a first region of the first board face; a second component disposed in a second region of the second board face overlapping with the first region; a first shield including a first side wall formed facing the second direction, the first shield covering the first region; a second shield including a second side wall formed facing the second direction, the second shield covering the second region; and a bonding material formed between the first side wall or second side wall and the side board face. The electronic device as described above may be variously implemented according to embodiments.