A waste recycling mechanism is disposed on a film cutting machine and includes a fixing plate fixed to a cutting template of the film cutting machine, a pressing-head device disposed on the fixing plate, a tape, a tape reel and a collection device disposed on a platform of the film cutting machine. The tape is wound on the tape reel and is connected to the collection device after being wound on the pressing-head device. When the fixing plate moves downward with a cutting motion of the cutting template, the pressing-head device presses a film waste to make the tape attached to the film waste. When the fixing plate moves upward, the collection device reels in the tape to make a portion of the tape having the film waste separate from the pressing-head device and make a portion of the tape without any film waste wound on the pressing-head device.