An applicator for applying two materials to a substrate includes a central module configured to receive a first material, a tee block configured to receive a second material, a pair of outer modules spaced from and disposed on opposite sides of the central module, each outer module fluidically connected to and configured to receive the second material from the tee block, and a slot die assembly disposed in fluid communication with the central module and the pair of outer modules, the slot die assembly configured to receive the first and second materials from the central and outer modules, respectively, and discharge the first material over a first width and the second material over a second width greater than the first width.