- 专利标题: Liquid ejecting head, ejecting element substrate and liquid ejecting apparatus
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申请号: US15155590申请日: 2016-05-16
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公开(公告)号: US09889650B2公开(公告)日: 2018-02-13
- 发明人: Takuma Kodoi , Keiji Tomizawa
- 申请人: CANON KABUSHIKI KAISHA
- 申请人地址: JP Tokyo
- 专利权人: Canon Kabushiki Kaisha
- 当前专利权人: Canon Kabushiki Kaisha
- 当前专利权人地址: JP Tokyo
- 代理机构: Fitzpatrick, Cella, Harper & Scinto
- 优先权: JP2015-104876 20150522
- 主分类号: B41J2/145
- IPC分类号: B41J2/145 ; B41J2/14
摘要:
There are provided a liquid ejecting head, an ejecting element substrate and a liquid ejecting apparatus that can suppress degradation in print quality. Therefore in an ejecting element substrate arranged the closest to the center of a support member, a flow resistance of a flow passage corresponding to an ejection opening of an ejection opening array arranged the closest to the center of the ejecting element substrate is made high.
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