Invention Grant
- Patent Title: Molded printhead structure
-
Application No.: US15372366Application Date: 2016-12-07
-
Publication No.: US09889664B2Publication Date: 2018-02-13
- Inventor: Chien-Hua Chen , Michael W. Cumbie
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agency: HP Inc. Patent Department
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/16
Abstract:
In one example, a printhead structure includes multiple printhead dies and a printed circuit board embedded in a single monolithic molding with fully encapsulated wire bonds that electrically connect the dies to conductive routing in the printed circuit board. Fluid may pass through a slot in the molding directly to the dies.
Public/Granted literature
- US20170120590A1 MOLDED PRINTHEAD STRUCTURE Public/Granted day:2017-05-04
Information query
IPC分类:
