Polymeric barriers for organic light emitting diodes are formed in-situ by encapsulation or polymerization. Encapsulation with melamine-cyanurate is performed using sublimation reaction technique. An encapsulation technique involves curing a layer of resin made by mixing a polyaza aryl compound, such as melamine, melam, or melem, with a cyanuryl triglycidyl ether. Another encapsulation technique involves curing a layer of resin made by mixing the polyaza aryl aromatic compound in 2,4,6-tricyanatophenyl glycidyl ether or tetracyanatobenzene applied to an organic light emitting diode. Photo catalytic curing of the coating may be achieved in the presence of catalysts such as titanium IV oxide acetylacetonate.