Invention Grant
- Patent Title: Prepreg, metal-clad laminated plate and printed wiring board
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Application No.: US15173697Application Date: 2016-06-05
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Publication No.: US09894761B2Publication Date: 2018-02-13
- Inventor: Takashi Hoshi , Takeshi Kitamura , Keiko Kashihara , Hiroharu Inoue
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2015-119103 20150612
- Main IPC: H05K1/03
- IPC: H05K1/03 ; H05K1/02 ; C08J5/24 ; C08G59/62 ; C08L63/00

Abstract:
A prepreg includes a resin composition including: (A) at least one of an epoxy resin having a naphthalene skeleton and a phenolic hardener having a naphthalene skeleton; (B) a polymer having at least the structures of formulae (2) and (3) among formulae (1), (2) and (3) and having a weight-average molecular weight of from 200,000 to 850,000 inclusive; and (C) an inorganic filler: wherein x:y:z (molar fraction)=0:0.95:0.05 to 0.2:0.6:0.2 (where x+y+z≦1, 0≦x≦0.2, 0.6≦y≦0.95, 0.05≦z≦0.2); R1 represents a hydrogen atom or a methyl group and R2 includes at least one of a glycidyl group and an epoxidized alkyl group among a hydrogen atom, an alkyl group, a glycidyl group and an epoxidized alkyl group in formula (2); and R3 represents a hydrogen atom or a methyl group and R4 represents Ph (phenyl group), —COOCH2Ph or —COO(CH2)2Ph in formula (3).
Public/Granted literature
- US20160366761A1 PREPREG, METAL-CLAD LAMINATED PLATE AND PRINTED WIRING BOARD Public/Granted day:2016-12-15
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