Invention Grant
- Patent Title: Carrier, semiconductor package and fabrication method thereof
-
Application No.: US14174988Application Date: 2014-02-07
-
Publication No.: US09899237B2Publication Date: 2018-02-20
- Inventor: Chiang-Cheng Chang , Meng-Tsung Lee , Jung-Pang Huang , Shih-Kuang Chiu
- Applicant: Siliconware Precision Industries Co., Ltd
- Applicant Address: TW Taichung
- Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee Address: TW Taichung
- Agency: Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
- Agent Peter F. Corless; Steven M. Jensen
- Priority: TW101102490A 20120120
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/31 ; H01L21/56 ; H01L21/673 ; H01L21/768 ; H01L21/78 ; H01L21/68 ; H01L21/48 ; H01L21/683 ; H01L21/677

Abstract:
A fabrication method of a semiconductor package includes the steps of: providing a carrier having a concave portion and a releasing layer formed on a surface thereof; disposing a chip on the releasing layer in the concave portion; forming an encapsulant on the chip and the releasing layer; removing the releasing layer and the carrier; and forming a circuit structure on the encapsulant and the chip. The design of the concave portion facilitates alignment of the chip to prevent it from displacement, thereby improving the product reliability. A semiconductor package fabricated by the fabrication method is also provided.
Public/Granted literature
- US20140154842A1 CARRIER, SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF Public/Granted day:2014-06-05
Information query
IPC分类: