Invention Grant
- Patent Title: Cap layer for spacer-constrained epitaxially grown material on fins of a FinFET device
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Application No.: US14644269Application Date: 2015-03-11
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Publication No.: US09899268B2Publication Date: 2018-02-20
- Inventor: Andy C. Wei , Guillaume Bouche
- Applicant: GLOBALFOUNDRIES Inc.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee Address: KY Grand Cayman
- Agency: Amerson Law Firm, PLLC
- Main IPC: H01L21/8238
- IPC: H01L21/8238 ; H01L29/10 ; H01L27/092 ; H01L29/78

Abstract:
A method includes forming at least one fin in a semiconductor substrate. A fin spacer is formed on at least a first portion of the at least one fin. The fin spacer has an upper surface. The at least one fin is recessed to thereby define a recessed fin with a recessed upper surface that it is at a level below the upper surface of the fin spacer. A first epitaxial material is formed on the recessed fin. A lateral extension of the first epitaxial material is constrained by the fin spacer. A cap layer is formed on the first epitaxial material. The fin spacer is removed. The cap layer protects the first epitaxial material during the removal of the fin spacer.
Public/Granted literature
- US20160268171A1 CAP LAYER FOR SPACER-CONSTRAINED EPITAXIALLY GROWN MATERIAL ON FINS OF A FINFET DEVICE Public/Granted day:2016-09-15
Information query
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