Invention Grant
- Patent Title: Chip aware thermal policy
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Application No.: US15097429Application Date: 2016-04-13
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Publication No.: US09900424B2Publication Date: 2018-02-20
- Inventor: Wei-Ting Wang , Han-Lin Li , Hong-Jie Huang
- Applicant: MEDIATEK INC.
- Applicant Address: TW HsinChu
- Assignee: MEDIATEK INC.
- Current Assignee: MEDIATEK INC.
- Current Assignee Address: TW HsinChu
- Agency: Imperium Patent Works
- Agent Helen Mao
- Main IPC: G08B17/00
- IPC: G08B17/00 ; H04M1/725

Abstract:
Methods and apparatus are provided for chip aware thermal policies. The thermal performance mapping information is generated. The process obtains a set of process-dependent power data for each process corner of a semiconductor chip, profiles performance data, and selects an operating thermal policy based on the performance data. The thermal policy, based on the process-dependent power data is a mapping formula, or a combination of a mapping formula and a mapping table. The chip aware thermal control is based on process-dependent power data of process corners. The mapping information of process-dependent power data to a corresponding thermal policy is stored in a memory. A thermal policy is applied based on the stored mapping information and an obtained process corner information. The mapping information is applied every time the thermal policy is needed or at boot-up time.
Public/Granted literature
- US20170302782A1 Chip Aware Thermal Policy Public/Granted day:2017-10-19
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