Invention Grant
- Patent Title: Methods for distributing power in layout of IC
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Application No.: US14986275Application Date: 2015-12-31
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Publication No.: US09904752B2Publication Date: 2018-02-27
- Inventor: Zwei-Mei Lee , Bo-Jr Huang , Chi-Jih Shih , Jia-Wei Fang
- Applicant: MediaTek Inc.
- Applicant Address: TW Hsin-Chu
- Assignee: MEDIATEK INC.
- Current Assignee: MEDIATEK INC.
- Current Assignee Address: TW Hsin-Chu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
A method for distributing power in the layout of an integrated circuit is provided. The integrated circuit includes at least one macro block. A first physical layout of the macro block is obtained, wherein the macro block includes a plurality of standard cells. The first physical layout is divided into a plurality of partitions according to an IR simulation result of the first physical layout. A plurality of power isolation cells are inserted between the partitions. A second physical layout is obtained according to the partitions and the power isolation cells. A macro placement of the macro block is obtained according to the second physical layout. Each of the partitions further includes a low drop out (LDO) regulator.
Public/Granted literature
- US20160217243A1 METHODS FOR DISTRIBUTING POWER IN LAYOUT OF IC Public/Granted day:2016-07-28
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