Invention Grant
- Patent Title: Metal conducting structure and wiring structure
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Application No.: US14983484Application Date: 2015-12-29
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Publication No.: US09905327B2Publication Date: 2018-02-27
- Inventor: Yuan-Ling Tsai , Ying-Jung Chiang , Jiun-Jang Yu
- Applicant: Industrial Technology Research Institute
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Priority: TW104138405A 20151120
- Main IPC: H01B3/30
- IPC: H01B3/30 ; B32B15/01 ; B32B3/26 ; B32B7/04 ; B32B3/30 ; B32B15/04 ; B32B15/092 ; B32B15/16 ; B32B15/20 ; H01B1/22 ; H01B1/20

Abstract:
A metal conducting structure includes a first metal conducting layer, a second metal conducting layer, and a third metal conducting layer. The first metal conducting layer consists of a first polymer material and first metal particles. The first metal conducting layer is covered by the second metal conducting layer which is a structure with pores, the structure consists of second metal particles. The second metal conducting layer is covered by the third metal conducting layer. The pores of the second metal conducting layer are filled with a metal material of the third metal conducting layer.
Public/Granted literature
- US20170148540A1 METAL CONDUCTING STRUCTURE AND WIRING STRUCTURE Public/Granted day:2017-05-25
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