Invention Grant
- Patent Title: Wiring circuit board and method of manufacturing the same
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Application No.: US15367494Application Date: 2016-12-02
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Publication No.: US09905496B2Publication Date: 2018-02-27
- Inventor: Yukie Yamada
- Applicant: NHK SPRING CO., LTD.
- Applicant Address: JP Kanagawa
- Assignee: NHK Spring Co., Ltd.
- Current Assignee: NHK Spring Co., Ltd.
- Current Assignee Address: JP Kanagawa
- Agency: Norris McLaughlin & Marcus, P.A.
- Priority: JP2015-248931 20151221
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/48

Abstract:
A flexure has a metal support layer, an electric insulating layer laid on a surface of the metal support layer, a wiring layer having a general part laid on a surface of the electric insulating layer and a terminal to provide a conductive connection to an external slider, and a raising structure in a thickness direction of the wiring layer provided to the terminal independently of the metal support layer so that the terminal protrudes from a surface of the general part or has a surface being flush with the surface of the general part.
Public/Granted literature
- US20170179005A1 WIRING CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2017-06-22
Information query
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