- 专利标题: Semiconductor device
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申请号: US15439625申请日: 2017-02-22
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公开(公告)号: US09905499B2公开(公告)日: 2018-02-27
- 发明人: Shoji Yasunaga , Mamoru Yamagami
- 申请人: ROHM CO., LTD.
- 申请人地址: JP Kyoto
- 专利权人: ROHM CO., LTD.
- 当前专利权人: ROHM CO., LTD.
- 当前专利权人地址: JP Kyoto
- 代理机构: Hamre, Schumann, Mueller & Larson, P.C.
- 优先权: JP2011-238577 20111030; JP2011-238575 20111031; JP2011-238576 20111031; JP2011-238578 20111031; JP2011-238579 20111031; JP2012-224920 20121010
- 主分类号: H01L23/49
- IPC分类号: H01L23/49 ; H01L23/495 ; H01L23/31 ; H01L23/373
摘要:
[Object] A semiconductor device is configured to release heat from semiconductor chips more efficiently. [Means for Solution] A semiconductor device includes: a die pad 11 which has a die pad main surface 111 and a die pad rear surface 112; a semiconductor chip 41 mounted on the die pad main surface 111; a sealing resin portion 7 formed with a recess 75 for exposure of the die pad rear surface 11 and covering the die pad 11 and the semiconductor chip 41; and a heat releasing layer 6 disposed in the recess 75. The recess 75 has a recess groove 753 outside the die pad 11 in a direction in which the die pad rear surface 112 extends, and the recess groove 753 is closer to the die pad main surface 111 than to the die pad rear surface 112. The heat releasing layer 6 has a junction layer which is in contact with the die pad rear surface 112 and having part thereof filling the recess groove 753.
公开/授权文献
- US20170162485A1 SEMICONDUCTOR DEVICE 公开/授权日:2017-06-08