Invention Grant
- Patent Title: Modular fuses and antifuses for integrated circuits
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Application No.: US14937812Application Date: 2015-11-10
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Publication No.: US09905511B2Publication Date: 2018-02-27
- Inventor: John H. Zhang , Yiheng Xu , Lawrence A. Clevenger , Carl Radens , Edem Wornyo
- Applicant: STMicroelectronics, Inc. , International Business Machines Corporation
- Applicant Address: US TX Coppell US NY Armonk
- Assignee: STMICROELECTRONICS, INC.,INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: STMICROELECTRONICS, INC.,INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US TX Coppell US NY Armonk
- Agency: Seed Intellectual Property Law Group LLP
- Main IPC: H03H11/40
- IPC: H03H11/40 ; H01L23/525 ; H01L49/02 ; H01F17/02 ; H01L23/522 ; H01F17/00

Abstract:
Nanoscale efuses, antifuses, and planar coil inductors are disclosed. A copper damascene process can be used to make all of these circuit elements. A low-temperature copper etch process can be used to make the efuses and efuse-like inductors. The circuit elements can be designed and constructed in a modular fashion by linking a matrix of metal columns in different configurations and sizes. The number of metal columns, or the size of a dielectric mesh included in the circuit element, determines its electrical characteristics. Alternatively, the efuses and inductors can be formed from interstitial metal that is either deposited into a matrix of dielectric columns, or left behind after etching columnar openings in a block of metal. Arrays of metal columns also serve a second function as features that can improve polish uniformity in place of conventional dummy structures. Use of such modular arrays provides flexibility to integrated circuit designers.
Public/Granted literature
- US20160064326A1 MODULAR FUSES AND ANTIFUSES FOR INTEGRATED CIRCUITS Public/Granted day:2016-03-03
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