- 专利标题： Noise blocking printed circuit board and manufacturing method thereof
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申请号： US14656237申请日： 2015-03-12
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公开(公告)号： US09907157B2公开(公告)日： 2018-02-27
- 发明人: Se Jong Kim , Sang Ho Choi , Jeong Hae Kim , Hyung Jun Cho
- 申请人： Samsung Electro-Mechanics Co., Ltd.
- 申请人地址： KR Suwon-si
- 专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址： KR Suwon-si
- 代理机构： NSIP Law
- 优先权： KR10-2014-0147089 20141028
- 主分类号： H05K1/03
- IPC分类号： H05K1/03 ; H05K1/02 ; H05K1/18
摘要：
There are provided a printed circuit board and a manufacturing method thereof. The printed circuit board includes: a core layer having a cavity provided therein; an electronic component included in the cavity; a conductive partition disposed on a side of the cavity; and insulating layers disposed on and below the core layer.
公开/授权文献
- US20160120025A1 PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF 公开/授权日：2016-04-28
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